www.rfm.com e-mail: info@rfm.com page 1 of 5 ?2009-2010 by rf monolithics, inc. SF2079E - 7/21/10 electrical characteristics characteristic sym notes min typ max units center frequency f c 1 251.045 mhz insertion loss il 12.5 15.0 db amplitude ripple fc - 6.2500 to fc - 4.3925 mhz 1, 2 1.3 2.0 db p-p fc - 4.3925 to fc - 2.5350 mhz 0.5 1.5 fc - 2.5350 to fc - 0.0250 mhz 0.5 1.5 fc + 0.0250 to fc + 2.5350 mhz 0.7 1.5 fc + 2.5350 to fc + 4.3925 mhz 0.6 1.5 fc + 4.3925 to fc + 6.2500 mhz 0.9 2.5 1.5 db bandwidth centered at fc 13.4 mhz 3.0 db bandwidth centered at fc 14.1 low side attenuation < 234.545 mhz ( < fc - 16.5 mhz) 35 38 low side attenuation, 234.545 to 240.545 mhz (fc - 10.5 mhz) 32 34 db high side attenuation, 260.045 to 267.545 mhz (fc + 9.0 mhz) 14 26 high side attenuation > 267.545 mhz ( > fc + 16.5 mhz) 30 35 temperature coefficient of frequency -18 ppm/k group delay ripple fc - 6.2500 to fc - 4.3925 mhz 1, 2, 3 44 90 ns p-p fc - 4.3925 to fc - 2.5350 mhz 37 70 fc - 2.5350 to fc - 0.0250 mhz 39 120 fc + 0.0250 to fc + 2.5350 mhz 40 120 fc + 2.5350 to fc + 4.3925 mhz 34 70 fc + 4.3925 to fc + 6.2500 mhz 37 90 source/load impedance 150 ohms case style 6 sm3030-8 3.0 x 3.0 mm nominal footprint lid symbolization (yy=year, ww=week, s=shift) see note 4 tbd ywws ? low insertion loss 3.0 x 3.0 x 1.2 mm surface-mount case differential input and output complies with directive 2002/95/ec (rohs) absolute maximum ratings rating value units maximum incident power in passband +10 dbm dc voltage on any non-ground terminal 30 vdc operating temperature range -40 to +85 c storage temperature range -60 to +95 c suitable for lead-free soldering - maximum soldering profile 260 c for 30 s 251.045 mhz saw filter SF2079E pb notes: 1. unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with impedance matching to 50 ? and measured with 50 ? network analyzer. 2. unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc. 3. rejection is measured as attenuation below the minimum il point in the passband. rejection in final user application is dependent on pcb layout and external impedance matching design. see application note no. 42 for details. 4. the design, manufacturing process, and specifications of this filter are subject to change. 5. tape and reel standard per ansi / eia 481. 6. us and international patents may apply. 7. rfm, stylized rfm logo, and rf monolithics, inc. are registered trademarks of rf monolithics, inc. sm3030-8 caution: electrostatic sensitive device. observe precautions for handling. notes: preliminary
www.rfm.com e-mail: info@rfm.com page 2 of 5 ?2009-2010 by rf monolithics, inc. SF2079E - 7/21/10
www.rfm.com e-mail: info@rfm.com page 3 of 5 ?2009-2010 by rf monolithics, inc. SF2079E - 7/21/10 pcb 401-1724-001 pcb, demo, 3.0 or 3.8 pkg, pins 1&2 in, 5&6 out j1,j2,j3,j4 500-1279-001 connector, sma female, end launch, 062? thick pcb l1,l2 501-1068-390 in ductor, chip, 39 nh 0603 l3,l4 501-1068-470 in ductor, chip, 47 nh 0603 c1 501-0857-150 capacitor, chip, 15 pf 0402 c2 501-0857-120 capacitor, chip, 12 pf 0402 c3 501-0857-010 capacitor, chip, 1.0 pf 0402 c4 501 - 0 857-005 capacitor , c hip, 0 .5 p f 0402
www.rfm.com e-mail: info@rfm.com page 4 of 5 ?2009-2010 by rf monolithics, inc. SF2079E - 7/21/10 a 1 2 3 b 7 6 5 4 c h 4 e f g 8 d 8 7 6 5 1 2 3 tbd ywws 8-terminal ceramic surface-mount case 3.0 x 3.0 mm nominal footprint top view bottom view pcb footprint top view case materials materials solder pad plating 0.3 to 1.0 m gold over 1.27 to 8.89 m nickel lid plating 2.0 to 3.0 m nickel body al 2 o 3 ceramic pb free dimension mm inches min nom max min nom max a 2.87 3.0 3.13 0.113 0.118 0.123 b 2.87 3.0 3.13 0.113 0.118 0.123 c 1.14 1.27 1.40 0.045 0.050 0.055 d 0.79 0.92 1.05 0.031 0.036 0.041 e 0.62 0.75 0.88 0.024 0.029 0.034 f 0.47 0.60 0.73 0.018 0.024 0.029 g 0.47 0.60 0.73 0.018 0.024 0.029 h 1.07 1.20 1.33 0.042 0.047 0.052 i 3.19 0.126 j 0.81 0.032 k 0.96 0.038 l 0.81 0.032 m 1.39 0.055 n 0.23 0.009 o 0.38 0.015 case and pcb footprint dimensions
www.rfm.com e-mail: info@rfm.com page 5 of 5 ?2009-2010 by rf monolithics, inc. SF2079E - 7/21/10 ro.3 (max.) 1.4 section a-a 0.3 section b-b 3.35 2.0 4.0 3.35 8.0 b b a r0.5 (typ.) a 5 . 5 1 2 . 0 1 . 7 5 1.5 1.5 tape and reel specifications ?b? quantity per reel inches millimeters 7 178 500 13 330 3000 pin #1 user direction of feed component orientation see detail "a" 1 3 . 0 2 0 . 2 2.0 12.0 1 0 0 r e f . " b " r e f . carrier tape dimensions ao 3.35 mm bo 3.35 mm ko 1.4 mm pitch 8.0 mm w 12.0 mm
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